Blog posts

Sih's Strain Energy Density Approach in Fracture - why is it not very popular?

Submitted by yoursdhruly on Fri, 07/13/2007 - 19:46

Most fracture classes and texts focus on the following different approaches: Griffith's energy approach, Irwin's stress intensity factor approach, the Barenblatt-Dugdale strip yield model (and subsequently, cohesive zone modeling) and Rice's J-Integral approach. As a graduate student studying fracture mechanics, I have often wondered why there seems to be very little discussion in the community with regard to Sih's strain energy density approach. Are there any fundamental limitations to the approach or are there "other" reasons behind this? Your thoughts are appreciated.

Polyelectrolyte gels

Submitted by Zhigang Suo on Fri, 07/13/2007 - 13:27

education

hydrogel

stress singularity and stress relationship

Submitted by msd.jacob on Fri, 07/13/2007 - 11:15

education

Dear All

Williams analysis is well known for stress singularity. Actually when we are analysing the stress distributions between two diffrent configuration which is given below ,based on the stress singularity, I got a doubt...how the order of stress singularity is directly related with the stress. (we can get the relationship using equation) however if i want to explain to a student who never come across with applied mechanics. How can we explain to him in very simple and understandable manner.

zienkiewicz

Submitted by sikanth on Thu, 07/12/2007 - 23:16

opinion

error estimator

hi all,

i would like to know how can i find the error in a heat transfer problem with the help of

zienkiewicz zhu error estimator.

Is there any good textbook for introductory engineering fracture mechanics for undergraduate students?

Submitted by Xuejun Fan on Thu, 07/12/2007 - 21:26

Can you recommend some good textbooks for Engineering Fracture Mechanics that is suitable for undergraduate students?

New Book - Mechanics of Microelectronics

Submitted by Xuejun Fan on Thu, 07/12/2007 - 21:19

education

You may want to take a look of this newly published book entitled Mechanics of Microelectronics, which is

Series: Solid Mechanics and Its Applications , Vol. 141

Springer, May 2006

authored by G.Q. Zhang, W.D. van Driel, and X.J. Fan http://www.springer.com/east/home/engineering?SGWID=5-175-22-165281764-detailsPage=ppmmedia|toc

Lateral Force Microscopy

Submitted by Will Adams on Thu, 07/12/2007 - 20:09

research

atomic force microscopy

AFM

I would like to do lateral force microscopy on biological samples. The more I look into it, it seems it is very difficult to calibrate AFM tips for lateral force microscopy. Does anyone have any suggestions about how to calibrate tips and which tips are conducive for lateral AFM?

Body loads in wave propagation..

Submitted by ramdas chennamsetti on Thu, 07/12/2007 - 08:33

Hi all,

[1] In solids, the wave propagation equation is obtained from stress equilibrium equations. We make use of constitutive and strain-displacement relations to convert these equations in terms of displacements

[2] In the above equations we assume that there are no body loads.

[3] The form of solution we assume for displacements is harmonic

[4] Plug these three displacements, u1, u2 and u3 in the equilibrium equations stated in [1].

[5] We end up with an Eigenvalue problem. This is nice.

Fifth European Conference on Constitutive Models for Rubber

Submitted by ErwanVerron on Wed, 07/11/2007 - 18:24

conference

If you are interested by the mechanics of elastomers, there is a dedicated conference for you : ECCMR 5, which will be held in Paris, France, 4-7 September 2007.

It is the fifth edition of the European Conference on Constitutive Models for Rubber Conference. The call for paper is now closed, but registration is still open.

See the conference web page: http://eccmr.egim-mrs.fr/

NSF Mini Travel Grants - 10th Pan American Congress Appl. Mech

Submitted by Nanshu Lu on Wed, 07/11/2007 - 17:41

The National Science Foundation (NSF) has made a recent award to help increase graduate student participation at the Tenth Pan American Congress of Applied Mechanics (PACAM X). These awards will be made in the form of mini-travel grants ($500 - $1,000) for exceptionally qualified students to participate in PACAM X January 7-11, 2008, in beautiful Cancun, Mexico.

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