Packaging mechanical engineers conduct simulation of electronic packages
to optimize package design for compatibility with assembly processes
and for reliable operation in end user systems such as servers, game
consoles and network switches. Simulation is conducted using commercial
finite element software such as ANSYS or ABAQUS to predict package
component stresses and strains. Simulations are verified by measurements
of warpage and stresses / strains in the packages using Digital image
contrast, strain gages, capacitance meters, etc. Package material
properties such as coefficient of thermal expansion, Poisson ratio and
modulus that are required for simulation are measured using specialized
mechanical equipment. Thus, familiarity with numerical simulation

ANSYS Regional Conference - Users Group Meeting in Houston



Date: August 31 - September 1, 2011



Venue:

Omni Houston Hotel Westside

13210 Katy Freeway

Houston, Texas, U.S.A. 77079



Website:
http://www.ansys.com/Conference/Houston/




As the oil and gas industries
focus increasingly on subsea and unconventional sources, achieving the
industry's objectives for safety, reliability, yield, and efficiency

Imperial College London

Department of Mechanical Engineering

Less than 3 weeks left to take advantage of the Early Bird Offer. Go to http://www.biotribologyconference.com/registrationInfo.asp

Review of Elasticity Equations

Linear, homogeneous, isotropic material behavior.

Silicon can host a large amount of lithium, making it a promising electrode for high-capacity lithium-ion batteries.  Recent experiments indicate that silicon experiences large plastic deformation upon Li absorption, which can significantly decrease the stresses induced by lithiation and thus mitigate fracture failure of electrodes. These issues become especially relevant in nanostructured electrodes with confined geometries.