WCCM2018: Mini-Symposium ID: 225 "MODELLING OF MICROSTRUCTURE-DEPENDENT DAMAGE AND FRACTURE OF HETEROGENEOUS MATERIALS"
Dear Colleagues,
We cordially invite you to present your research work at the mini-symposium – “MODELLING OF MICROSTRUCTURE-DEPENDENT DAMAGE AND FRACTURE OF HETEROGENEOUS MATERIALS” at the 13th World Congress on Computational Mechanics (New York City, from July 22 to 27 of 2018). The session ID is 225 (Link: http://www.wccm2018.org/MS_225).
Submission deadline: December 31, 2017. Session description is given below. We look forward to your contribution in this min-symposium.
Best regards