These are the notes I wrote at the Technical University of Denmark in 1979. Zhigang Suo and I will be using these in the course on fracture and thin film mechanics (ES 242r) this spring (2007). This is a joint course with the University of Nebraska.
Time. Thursday and Tuesday. 1:30-3:00 pm (Harvard University), 12:30-2:2:00 pm (University of Nebraska). First meeting: 1 February 2007
Place. Harvard University: Fairchild 102 (map). University of Nebraska: 111 Walter Scott Engineering Center
Course website (this page): node/754
Instructors
Let's say the world has only e-books, then someone introduces this technology called 'paper.' It's cheap, portable, lasts essentially forever, and requires no batteries. You can't write over it once it's been written on, but you buy more very cheaply. Wouldn't that technology come to dominate the market?
The SES 2007 Conference, Oct. 21-24, 2007, Texas A&M University campus in College Station, Texas, home to the George Bush Presidential Library and Museum.
Symposium: Plasticity and Damage Size Effects at the Micron and Nano Length Scales
(Please also refer to node/711 for the introduction of this ASME meeting and some important changes. )
Mechanics has been playing a critical role in understanding the fabrication and reliability of nanostructured material systems, such as the self-assembly of quantum dots during heteroepitaxial thin film growth. Sponsored by the Elasticity Committee of Applied Mechanics Division, this symposium will identify opportunities and challenges in mechanics of materials that are motivated from a variety of novel and emerging nanofabrication and nanostructure growth methods. Presentations in experimental, theoretical, and computational studies are solicited in the following areas (but not limited to):
A subdomain collocation method based on Voronoi diagrams and reproducing kernel approximation is presented. The unkonwn field variables are approximated via reproducing kernel approximation. The body integration arising from the numerical evaluation of Galerkin weak form is converted into much cheaper contour integration along the boundary of each Voronoi cell. The Voronoi cells also provide an natural structure to perform h-adaptivity.
An approximate predictive model is developed for the evaluation of the interfacial thermal stresses in a soldered bi-material assembly with a low-yield-stress bonding material. This material is considered linearly elastic at the strain level below the yield point and ideally plastic at the higher strains. The results of the analysis can be used for the assessment of the thermally induced stresses
Smart materials have received much attention in recent years, especially due to their various applications in smart structures, medical devices, actuators, space and aeronautics. Among these
materials, shape memory alloys exhibit extremely large, inelastic, recoverable strains (of the order of 10%), resulting from transformation between austenitic and martensitic phases. This
transformation may be induced by a change, either in the applied stress, the temperature, or both.
News of Texas Instruments are intriguing. The world's largest maker of chips for mobile phones has just posted good fourth-quarter earnings. Despite the gains, the company said it will further increase efficiency and profitability by extending the model of outsourcing. This time it will include development of certain chips. The news on the Internet is rather terse. Will the company drastically reduce its research and development activities? Will many people lose jobs?
Some of you may be interested in attending this conference, and the post-conference tour. Details are described in the two attached files.
