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Force Matrix for Transient Thermal Analysis

Submitted by shrimad on
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Transient thermal analysis

Hi,



I have developed a 2D transient thermal analysis FE code which doesn't
seem to be correct. I am sure there is a conceptual problem in the
formulation itself which I have not been able to understand and could
not find concrete information in books.



I am putting up the question in a very simplified form so as to address the correctness of the formulation.



Let's say we have a square of unit length with 4 nodes at each corner
(Q4 element). Initial temperatures are specified as 100 for all nodes

Nonequilibrium molecular dynamics for bulk materials and nanostructures

Submitted by Kaushik Dayal on
research
preprint

This is a preprint that of an article that will appear in J. Mech. Phys. Solids. (doi: 10.1016/j.jmps.2009.10.008).  Nonequilibrium molecular dynamics for bulk materials and nanostructures,
by Kaushik Dayal and Richard D. James

Announcing free version of Kalker's rolling contact model

Submitted by Edwin Vollebregt on
software
elasticity
rolling contact
contact mechanics
wheel/rail interface

Dear all,

Herewith I would like to announce that we have decided to make our CONTACT software publicly available. You can obtain a free copy at the web-site www.kalkersoftware.org. We hope that the software is beneficial to you. We further hope that you give us helpful feedback in return.

A new Method for Detection of Degradation in Die-Attach Materials by In-Situ-Health Monitoring of Thermal Properties

Submitted by mazloum on

The application of electronic products is established in many fields of everyday life, for example in automotive industry, medical or communication technology. This leads to the necessity of investigation of safety and reliability of such components. During lifetime testing of the electronic component different loads and mechanisms can lead to degradation and failure. For die attach materials these failures can be cohesive or adhesive in their nature.

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